Equipment

MRC’s 12,000 sq. ft. cleanroom supports advanced micro- and nanofabrication across silicon, III–V, and soft materials. Core capabilities include sub-20 nm electron-beam lithography, alongside deposition, etching, thermal processing, and comprehensive characterization tools.

MRC equipment is located in the North Cleanroom of the Microelectronics and Engineering Research Center (MER) on the J.J. Pickle Research Campus.

Training is required before independent use. Submit a training request for any instruments needed for your work. Once training is complete, instruments can be reserved through the Facility Billing System (FBS).

MRL Thermal Furnaces

Anneal (Doped) - MRL

Location: MER 1.756
Thermal
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MRL Thermal Furnaces

Anneal (Field Oxide) - MRL

Location: MER 1.756
Thermal
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MRL Thermal Furnaces

Anneal (Gate Oxide) - MRL

Location: MER 1.756
Thermal
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MRL Thermal Furnaces

Anneal (Undoped) - MRL

Location: MER 1.756
Thermal
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MRL Thermal Furnaces

Diffusion Doping POCl3 - MRL

Location: MER 1.756
Thermal
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Diffusion Pre-clean Hood Acid C-14

Location: MER 1.756
Thermal
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MiniBrute Furnace

Furnace (Sintering ) - MiniBrute

Location: MER 1.824
Thermal
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MRL Thermal Furnaces

LPCVD Amorphous Silicon - MRL

Location: MER 1.756
Thermal
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MRL Thermal Furnaces

LPCVD Low Temp Oxide - MRL

Location: MER 1.756
Thermal
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MRL Thermal Furnaces

LPCVD Nitride - MRL

Location: MER 1.756
Thermal
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UV Ozone Cleaner

UV Ozone Cleaner

Location: MER 1.756A
Thermal
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Rapid Thermal Anneal Silicon - Allwin 610

Rapid Thermal Anneal - Allwin ACCUTHERMO AW810M

Location: MER 1.756A
Thermal
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Rapid Thermal Process - AET

Rapid Thermal Process - AET

Location: MER 1.756A
Thermal
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Tytan 8 inch Furnaces

Tytan 3800 Furnace Stack

Location: MER 1.756
Thermal
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Vacuum Oven (Blue vacuum Oven)

Vacuum Oven (Blue Vacuum Oven)

Location: MER 1.756
Thermal
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AML Wafer Bonder

Wafer Bonder - AML

Location: MER 1.728
Thermal
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