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|
TEXAS
Research
TNF
@
MRC
Access
Equipment
Rates & Fees
Safety
Research
Contact
Breadcrumb
Microelectronics Research Center
Equipment
Wafer Bonder - AML
Wafer Bonder - AML
Substrate bonding anodic or thermal
Incompatible Materials:
None
Location
MER 1.728
Category
Thermal
