Equipment

MRC’s 12,000 sq. ft. cleanroom supports advanced micro- and nanofabrication across silicon, III–V, and soft materials. Core capabilities include sub-20 nm electron-beam lithography, alongside deposition, etching, thermal processing, and comprehensive characterization tools.

MRC equipment is located in the North Cleanroom of the Microelectronics and Engineering Research Center (MER) on the J.J. Pickle Research Campus.

Training is required before independent use. Submit a training request for any instruments needed for your work. Once training is complete, instruments can be reserved through the Facility Billing System (FBS).

Westbond Ball Bonder

Westbond Ball Wire Bonder 7400A

Location: MER 1.822
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westbond-wedge-bonder-

Westbond Wedge Wire Bonder

Location: MER 1.821
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K&S Au Ball Bonder

Wire Bonder (Au ball ) Kulicke & Soffa

Location: MER 1.820
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