Features:
- Spinner and hot plate to apply and cure photoresist
- Wafer Chuck Holders for 3" to 8" and 65 mm x 65 mm quartz template
- Nine (9) pre-programed recipes
Compatible Materials: Si / SiGe / Hi K Layers: Oxides / Nitrides / Top-Electrode Polysilicon, TaN, Al Chemicals: Photoresist / Developer / Acetone / Methanol / IPA
Incompatible Materials: III-V, Liftoff Processes, Corrosive Etching (except developer), Au, Ag, Hg, Cu developer
To Run Program:
- Set Temperature of Hotplate
- Wipe down Spinner Chamber with Acetone and Hotplate
Surface with DI Water - Select [RESET] "CEE 100CB AUTO DISP"
- Select [RUN] (Enter Program Number to be Run)
- Select [ENTER]
- Load Wafer on Spinner Chuck
- Select [START]
- Adjust Wafer to Center (To Re-Adjust Select 0)
- Dispense manually Solution to Center of Wafer and Close
Spinner Lid - Select [START]
- After Complete, Unload Wafer and Move to Hotplate for the
Specified Time.Close Hotplate Hood during Baking Procedure. - Remove Wafer From Hotplate and Allow to Cool
To Edit Program:
- Select [Program]
- Enter The Number Your Recipe is to be Stored as
- Select [ENTER]
- @ "DISPENSE 1=ON 0=OFF" Select [ 0 ]
- Select [ENTER]
- Enter the Velocities, RPM & Time Settings for Each of Your
Desired Ramps - PROGRAM VEL/0 ___RPM
- Select [ENTER]
- PROGRAM RMP/0 ___RPM
- Select [ENTER]
- PROGRAM TIME/0 ___SEC
- Select [ENTER]
- Continue Above Process For the Required Number of Ramps
Needed for Your Recipe - When Finished, (@ Next Sequential Ramp Entry) PROGRAM
VEL/# END RPM - Select [END] - Select [ENTER]